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According to reports, HMD is developing the HMD Fusion 2, a modular smartphone of the future. The HMD Fusion, which was just introduced in India, will be replaced by the next smartphone. The main features and specs of the HMD Fusion 2 have now been made public online. According to reports, the forthcoming smartphone will include new Smart Outfits, which were initially made available with HMD Fusion. Additionally, the phone is said to use the most recent Qualcomm Snapdragon 6s Gen 4 chipset.
Key Features and Specifications of the HMD Fusion 2 Were Leaked
The HMD Fusion 2 is expected to come with Smart Outfits Gen 2 with the new Pogo Pin 2.0, according to a post made by HMD Meme on X. The six smart pins on the phone allow you to connect these essentially customizable costumes.
HMD FUSION 2
— HMD_MEME'S (@smashx_60) October 24, 2025
- OLED 6.58" FHD+, 120Hz
- 108MP OIS + 8MP UW
- SD 6s Gen 4
- IP65, nfc, BT5.3, POGO Pin 2.0, Smart Outfits gen 2, Dual Speakers 3.5mm jack etc.
The tipster claims in another post that the company is preparing to launch new Smart Outfits, such as a Wireless Charging Outfit, a Rugged Outfit, a Camera Grip Outfit, a Flashy Outfit, a Speaker Outfit, a QR and Barcode Outfit, a Smart Projector Outfit, and a Casual Outfit with a Kickstand.
The New Smart Outfits Gen 2
— HMD_MEME'S (@smashx_60) October 25, 2025
- Casual Outfits w Kick Stand
- Wireless Charge Outfit
- Rugged Outfit
- Gaming Outfit
- Camera Grip Outfit
- Flashy Outfit
- Speaker Outfit
- QR & Barcode Scanner Outfit
- Smart Projector Outfit
Furthermore, according to the tipster, the next generation of smart clothing will not be compatible with the older models. Next, the source disclosed some important details about the next smartphone. First, a 6.58-inch OLED screen with Full HD+ quality is reportedly a feature of the phone. According to reports, the phone has a 120 Hz screen refresh rate.
The newly unveiled Qualcomm Snapdragon 6s Gen 4 chip is also said to power the HMD Fusion 2. Additionally, the phone may include a dual-camera configuration on the back panel, consisting of an 8-megapixel ultra-wide-angle lens and a 108-megapixel main sensor with OIS capabilities. According to reports, the phone also has a 3.5mm audio connector, twin speakers, Bluetooth 5.3, and IP65. Nevertheless, no details on the next modular smartphone's launch date have been revealed.
#hmdfusion2 #newstainmentora
